ILP-Based Router for Wire-Bonding FBGA Packaging Design

A new technical paper titled "ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design" was written by researchers at National Taiwan University of Science and Technology. "In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-depende... » read more