An Inside Look At Testing’s Leading Edge


Mike Slessor, president and CEO of FormFactor, sat down with Semiconductor Engineering to discuss testing of AI and 5G chips, and why getting power into a chip for testing is becoming more difficult at each new node. SE: How does test change with AI chips, where you've got massive numbers of accelerators and processors developed at 7 and 5nm? Slessor: A lot of the AI stuff that we've been... » read more

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies


This new whitepaper from Moortec takes a comprehensive look at the Implementation of Embedded PVT Monitoring Subsystems in Today’s Cutting Edge Technologies and how this can benefit today’s advanced node semiconductor design engineers by improving the performance and reliability of SoC designs. With advances in CMOS technology, and the scaling of transistor channel lengths to nanometer (nm)... » read more

Managing Electrical Communications Better


By Ann Steffora Mutschler Managing the electrical components of signal paths between IC, package, board and system is no small task, and it’s only growing in complexity. Understanding how to correctly optimize the communications within a system is critical given that the I/O power is becoming a significant portion of the overall chip power as the number of bits and the speed at which t... » read more