Chip Industry Week in Review

By The SE Staff - 07 Nov, 2025 - Comments: 0

SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

Breaking The Compromise: Low Power And High Performance For The Intelligent Edge

By Sevasti Daneilas - 06 Nov, 2025 - Comments: 0

By 2030, over 75 billion devices will be connected worldwide, each expected to think, learn, and respond instantly (Statista, IoT Connected Devices Forecast). The world is connecting faster than ever. With tens of billions of smart devices coming online, intelligence can no longer live in the cloud alone. Edge AI is emerging as the new frontier, bringing smarter, safer, and more res... » read more

Moving AI Workloads To The Edge

By Ann Mutschler - 06 Nov, 2025 - Comments: 0

Experts At The Table: Semiconductor Engineering gathered a group of experts to discuss how some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. The panel included Frank Ferro, group director in the Silicon Solutions Group at Cadence; Eduardo Montanez, vice president an... » read more

How Fast Can Germany Shift To Software-Defined Vehicles?

By Emma Riverso - 06 Nov, 2025 - Comments: 0

It's being called "China speed," defined by the accelerated rate at which software-defined vehicles can be designed, manufactured, and updated with new features. And nowhere is this hitting harder and forcing more profound changes than in Germany, Europe's leading automotive market. Rather than relying solely on customized electronic control units, SDVs use a combination of specialized and g... » read more

Classical Computing vs. Machine Learning and Edge AI Techniques in Various Application Domains

By Infineon - 06 Nov, 2025 - Comments: 0

Machine Learning (ML) algorithms have revolutionized various domains by enabling data-driven decision-making and automation. The deployment of ML models on embedded edge devices, characterized by their constrained computational resources and low power requirements, presents unique challenges and opportunities. As the digital world continues to generate increasingly complex and high-volume da... » read more

Small Vs. Large Language Models

By Ed Sperling - 03 Nov, 2025 - Comments: 0

The proliferation of edge AI will require fundamental changes in language models and chip architectures to make inferencing and learning outside of AI data centers a viable option. The initial goal for small language models (SLMs) — roughly 10 billion parameters or less, compared to more than a trillion parameters in the biggest LLMs — was to leverage them exclusively for inferencing. In... » read more

Chip Industry Week in Review

By The SE Staff - 31 Oct, 2025 - Comments: 0

San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Chip Industry Week in Review

By The SE Staff - 24 Oct, 2025 - Comments: 0

Retaliations and countermoves leading up to planned trade talks between the U.S. and China led experts to wonder, 'Who's winning?' New activity on this front: China issued questionnaires to some U.S. semiconductor firms as part of an anti-dumping probe, demanding detailed data on sales, profit margins, logistics costs and Chinese customer names for analog chips. The probe appears aimed at ... » read more

Chip Industry Week in Review

By The SE Staff - 17 Oct, 2025 - Comments: 0

The Open Compute Project (OCP) Summit kicked off this week in San Jose, dominated by open standards, massive scaling of AI infrastructure, chiplet architectures, and energy-efficiency. Among the highlights: An initiative to standardize data center infrastructure and advance Ethernet for AI. New contributions to OCP's Open Chiplet Economy ecosystem, including Arm's new Foundation Chiplet... » read more

Chip Industry Week in Review

By The SE Staff - 10 Oct, 2025 - Comments: 0

SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

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tag: Infineon

Chip Industry Week in Review

Breaking The Compromise: Low Power And High Performance For The Intelligent Edge

Moving AI Workloads To The Edge

How Fast Can Germany Shift To Software-Defined Vehicles?

Classical Computing vs. Machine Learning and Edge AI Techniques in Various Application Domains

Small Vs. Large Language Models

Chip Industry Week in Review

Chip Industry Week in Review

Chip Industry Week in Review

Chip Industry Week in Review

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