Automated High-Speed Interface Routing in Multi-Die Designs

By Synopsys - 28 Jan, 2026 - Comments: 0

2.5D and 3D Multi-die design is revolutionizing chip integration by enabling thousands of high-speed connections between dies (also called chiplets). Discover how close placement of dies boosts bandwidth, minimizes latency, and maximizes data throughput. Read this white paper to find out about the importance of interconnectivity planning and die-to-die signal routing for successful m... » read more

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Automated High-Speed Interface Routing in Multi-Die Designs

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