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The Week In Review: IoT


M&A TDK has agreed to acquire InvenSense for $13 a share, representing a total of $1.3 billion in cash. The transaction must be approved by InvenSense shareholders and regulatory agencies; TDK expects to wrap up the deal in the second quarter of its fiscal year ending in March of 2018 (the third quarter of the calendar year). Apple accounted for 40% of InvenSense’s revenue for the fiscal... » read more

The Week In Review: IoT


Tools Google this week updated its Internet of Things platform, releasing a Developer Preview for Android Things, enabling application developers to create IoT devices running on the mobile Android operating system. “We incorporated the feedback from Project Brillo to include familiar tools such as Android Studio, the Android Software Development Kit (SDK), Google Play Services, and Google C... » read more

Printed Cars, Smart Stints, Personal Breathalyzers


The MEMS and sensor market continues to be a hotbed for innovation, new opportunities and, as with most new frontiers, there are also some disparate views on market dynamics and strategies. All this was evident at the 2016 MSIG Executive Congress last week in Scottsdale, Arizona. First, I’ll cover the pioneering and fun subjects. In addition to the Technology Showcase demos and member pres... » read more

Can Low-Power Devices Be Secure?


Successfully designing a low-power, high-performance chip design is an accomplishment, but effectively implementing cybersecurity in such devices makes it much more difficult. Safety, particularly functional safety for automotive and military/aerospace applications, also can be a prime concern in creating low-power, high-performance integrated circuits and systems. When combined with securit... » read more

The Week In Review: Manufacturing


Samsung Austin Semiconductor plans to invest more than $1 billion in its fab in Austin, Texas. Today, the fab continues to ramp up the company’s 14nm finFET technology. At the same time, Samsung is expanding its advanced finFET foundry process technology offerings with its fourth-generation 14nm process (14LPU) and its third-generation 10nm technology (10LPU). Graphcore is developing a so-... » read more

Manufacturing Bits: Aug. 2


CMP replacement? For years, chipmakers have used chemical-mechanical-polishing (CMP) tools to smooth or polish the surface of a wafer. CMP works, but the technology is time-consuming and expensive. CMP can also leave unwanted residual patterns and defects near the surface. In response, Russia’s National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) has help... » read more

The Week In Review: Manufacturing


MEMS manufacturing A*STAR’s Institute of Microelectronics (IME) in Singapore has launched its third consortium to develop MEMS technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and a smaller form factor. The MEMS Consortium III consists of the following companies: Applied Materials, Coventor, Delta Electronics, GlobalFoundries, InvenS... » read more

MEMS: Flexible, Reusable Platforms Facilitate Innovation


As the game-changing enabler for whatever the emerging market of widespread fragmented intelligence turns out to look like, the MEMS sector is in some ways the bellwether for much of the greater semiconductor/components supply chain looking to rethink how to serve a wider range of fragmented applications with lower costs and faster time to market. Leaders from Cisco, InvenSense, Nasiri Ventures... » read more

What’s Next For MEMS


By Paula Doe While MEMS sensors and actuators are key to enabling most of the high profile markets of tomorrow, from wearables to smart objects in the Internet of Things, MEMS companies face challenges today in transitioning to those new opportunities as basic MEMS devices increasingly becoming commodities. Large corporations are hiring their own in-house MEMS engineers, as standard platforms ... » read more

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