Yield rises with mask protection; multiple sources will likely reduce costs.
Intel’s re-entry has kicked the competition into high gear, with massive spending on equipment and new fabs.
More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field.
Even small IoT designs can have plenty of complexity in architecture and integration.
An ecosystem is required to make chiplets a viable strategy for long-term success, and ecosystems are built around standards. Those standards are beginning to emerge today.
The backbone of computing architecture for 75 years is being supplanted by more efficient, less general compute architectures.
How long a chip is supposed to function raises questions design teams need to think about, including how much they trust aging models.
Servers today feature one or two x86 chips, or maybe an Arm processor. In 5 or 10 years they will feature many more.
Tradeoffs in AI/ML designs can affect everything from aging to reliability, but not always in predictable ways.
New technology could have an impact on NVM, in-memory processing, and neuromorphic computing.
But one size does not fit all, and fine-tuning is required.
Assembling systems from physical IP is gaining mindshare, but there are technical, business and logistical issues that need to be resolved before this will work.
Advanced nodes and packaging are turning minor issues into major ones.
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