Manufacturing Bits: May 11

By Mark LaPedus - 11 May, 2020 - Comments: 0

Covid-19 data mining Using machine learning and other technologies, Lawrence Berkeley National Laboratory (Berkeley Lab) has developed a data text-mining tool to help synthesize a growing amount of scientific literature on Covid-19. Each day, some 200 new journal articles are being published on the coronavirus alone, according to Berkeley Lab. Berkeley Lab’s data mining tool, which is liv... » read more

Power/Performance Bits: Oct. 3

By Jesse Allen - 03 Oct, 2017 - Comments: 0

Slowing down photonics Researchers at the University of Sydney developed a chip capable of optical data into sound waves, slowing data transfer enough to process the information. While speed is a major bonus with photonic systems, it's not as advantageous when processing data. By turning optical signals into acoustic, data can be briefly stored and managed inside the chip for processing, re... » read more

Power/Performance Bits: June 20

By Jesse Allen - 20 Jun, 2017 - Comments: 0

Batteries from scrap metal Scientists at the Chinese Academy of Sciences and Jilin University found a method to transform rusty stainless steel mesh into electrodes with outstanding electrochemical properties that make them ideal for potassium-ion batteries. The rust is converted directly into a compact layer with a grid structure that can store potassium ions. A coating of reduced graphite... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Jilin University

Manufacturing Bits: May 11

Power/Performance Bits: Oct. 3

Power/Performance Bits: June 20