Thermal Simulation And Optimization in 3D-IC Design (Intel, UCSB, Cadence)


A new technical paper titled "DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design" was published by researchers at Intel Corporation, University of California, Santa Barbara and Cadence. Abstract "Thermal analysis is crucial in 3D-IC design due to increased power density and complex heat dissipation paths. Although operator ... » read more

KAN Acceleration: Algorithm Hardware Co-Design Approach (Georgia Tech, National Tsing Hua Univ., TSMC)


A new technical paper titled "Hardware Acceleration of Kolmogorov-Arnold Network (KAN) in Large-Scale Systems" was published by researchers at Georgia Institute of Technology, National Tsing Hua University and TSMC. Abstract "Recent developments have introduced Kolmogorov-Arnold Networks (KAN), an innovative architectural paradigm capable of replicating conventional deep neural network (DNN... » read more