Unsolved Issues In Next-Gen Photomasks

By Mark LaPedus - 17 Feb, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

What’s Next In Fab Tool Technologies?

By Mark LaPedus - 12 May, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and other next-generation fab technologies with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fuj... » read more

The Quest For Curvilinear Photomasks

By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 16 May, 2014 - Comments: 0

IC Insights has released its rankings of the Q1 ‘14 top 25 semiconductor suppliers. Outside of the top five spots, there were numerous changes. MediaTek jumped up four positions. Also, last year’s Micron/Elpida merger created a new giant semiconductor company with Micron’s sales expected to be over $17 billion this year. Toshiba will demolish the No. 2 semiconductor fabrication facilit... » read more

One-On-One: Linyong Pang

By Mark LaPedus - 12 May, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss trends in the lithography and photomask business with Linyong “Leo” Pang, the new chief product officer and executive vice president at D2S, which focuses on model-based mask data preparation as well as other mask writing technologies. What follows are excerpts of that conversation. SE: Before you arrived at D2S you were at Luminescent, whic... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Luminescent

Unsolved Issues In Next-Gen Photomasks

What’s Next In Fab Tool Technologies?

The Quest For Curvilinear Photomasks

The Week In Review: Manufacturing

One-On-One: Linyong Pang