Tom Salmon, vice president of collaborative technology platforms at SEMI, talks about smart manufacturing, and the role of AI, smart gateways, and digital twins.
https://youtu.be/e9DQ_Xfc2K0
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China restricts U.S. processors; Samsung's CXL, DRAM module and roadmap; ASML's $2.7B retention bonus; U.S., Mexico partner up; Keysight's $1.5B offer to Spirent; Lam's new pulsed laser deposition; new OSAT center.
IC sales up; Taiwan's quake; Japan's big bets; Intel Foundry loss; edgeAI startup funding; smartphone market's recovery; robots; data center security; NoCs in 3D.
Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.
The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
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