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Week In Review: Auto, Security, Pervasive Computing


The U.S. Department of Defense updated the directive that governs the development and fielding of autonomous and semi-autonomous weapon systems. The revisions include an expanded focus on artificial intelligence, and reference to recently-established organizations like the DoD’s Chief Digital and Artificial Intelligence Office. NIST released a new guidance document aimed at helping organi... » read more

Auto Safety Tech Adds New IC Design Challenges


The role of AI/ML in automobiles is widening as chipmakers incorporate more intelligence into chips used in vehicles, setting the stage for much safer vehicles, fewer accidents, but much more complex electronic systems. While full autonomy is still on the distant horizon, the short-term focus involves making sure drivers are aware of what's going on around them — pedestrians, objects, or o... » read more

Week In Review: Manufacturing, Test


Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Week In Review: Manufacturing, Test


Deals Apple will pay $1 billion to buy Intel's smartphone modem unit. Under the terms of the agreement, Apple will hire 2,200 Intel employees and acquire Intel's IP and equipment. The deal, expected to close in Q4, puts an end to Intel's attempts to win a piece of the smartphone market. But the chipmaker retains the right to develop modems for non-smartphone applications, including PCs, IoT de... » read more

Week In Review: Design, Low Power


CEVA acquired the Hillcrest Labs business from InterDigital. Hillcrest Labs supplies software and components for sensor processing in consumer and IoT devices. Hillcrest Labs' MotionEngine sensor processing software already runs on CEVA DSPs (as well as ARM and RISC-V cores) and enables high accuracy 6-axis and 9-axis sensor fusion, dynamic sensor calibration, and application specific features ... » read more

Automakers Take On More Responsibility


Chip and EDA companies are scrambling to deal with stiff safety regulations and harsh environmental conditions for automotive chips, but automakers are making big changes of their own to ensure all those components work together as expected. The result is a significant shift of responsibilities of companies in the automotive supply chain. Carmakers traditionally have left verification, valid... » read more