The Architecture Decisions Behind A Production-Ready EDA AI Agent


The conversation about agentic AI in semiconductor and PCB design tends to focus on capability: what the agent can do, how much time it saves, and which parts of the workflow it can automate. That is a reasonable place to start, but that is not where the hard engineering happens. Organizations are now asking whether AI agents can take on meaningful portions of the workflow, not as assistants th... » read more

Intel Inside The Package


Mark Bohr, senior fellow and director of process architecture and integration at Intel, sat down with Semiconductor Engineering to discuss the growing importance of multi-chip integration in a package, the growing emphasis on heterogeneity, and what to expect at 7nm and 5nm. What follows are excerpts of that interview. SE: There’s a move toward more heterogeneity in designs. Intel clearly ... » read more