Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 20 Mar, 2020 - Comments: 0

National Instruments is offering free online training courses to anyone anywhere, until the end of April to help support the engineering community during COVID-19 crisis. Some instructor-led virtual training is available at reduced cost. NIWeek has been postponed this year until August 3-5, 2020. Click here for more news about how the semiconductor industry is handling COVID-19. AI, machi... » read more

Combating Counterfeit Semiconductors In The Military Supply Chain

By Rambus - 09 Oct, 2019 - Comments: 0

The reality: semiconductors are often counterfeits. In most current implementations, semiconductor authenticity is practically impossible to guarantee. The counterfeit market for semiconductors is real, sizable and growing: • 2012: According to a report produced by the Senate Armed Services Committee, more than 1,000,000 suspect counterfeit electronic components have been used in 1,800 sep... » read more

Power/Performance Bits: July 2

By Ed Sperling - 02 Jul, 2013 - Comments: 0

Using low-power Wi-Fi to track moving humans Based on a concept similar to radar and sonar imaging, researchers at MIT’s Computer Science and Artificial Intelligence Laboratory have created a system capable of seeing people through walls. Previous efforts to develop such a system have involved the use of expensive and bulky radar technology that uses a part of the electromagnetic spectrum on... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: military electronics

Week In Review: Auto, Security, Pervasive Computing

Combating Counterfeit Semiconductors In The Military Supply Chain

Power/Performance Bits: July 2