AI Feeds Vision Processor, Image Sensor Boom

By Susan Rambo - 03 Nov, 2022 - Comments: 0

Vision systems are rapidly becoming ubiquitous, driven by big improvements in image sensors as well as new types of sensors. While the sensor itself often is developed using mature-node silicon, increasingly it is connected to vision processors developed at the most advanced process nodes. That allows for the highest performance per watt, and it also allows designs to incorporate AI accelera... » read more

Digitalizing Water Monitoring

By Susan Rambo - 05 May, 2022 - Comments: 0

Managing water resources has always been important, but that monitoring is becoming increasingly high-tech and much more useful. Rather than a spot check at the tap, or a crude measurement of water levels in a reservoir, chips are making it possible to monitor and measure water quantity and quality at the source, wherever it is stored, the spigot, and in the wastewater systems. As climate ch... » read more

LiDAR Market Continues To Percolate

By Jeff Dorsch - 13 Sep, 2017 - Comments: 0

Light imaging, detection, and ranging (LiDAR) sensors are still dazzling investors and technologists. They are chasing after the technology for automotive applications, while also keeping an eye on LiDAR for drones, industrial automation, mapping, and robotics, among other uses. It’s too early to tell how market share for automotive LiDAR is shaping up, as the bigger vendors are still work... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Mordor Intelligence

AI Feeds Vision Processor, Image Sensor Boom

Digitalizing Water Monitoring

LiDAR Market Continues To Percolate