Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 May, 2022 - Comments: 0

Automotive, mobility Stellantis is buying Share Now, a car sharing service owned by BMW and Mercedes-Benz. Through the acquisition, Stellantis will be adding 3.4 million car sharing customers, 10,000 vehicles, and 14 new European cities to its Free2move car sharing service, which currently has 2 million users, 2,500 vehicles, and has 7 “mobility hubs” in the U.S. and Europe. ShareNow was a... » read more

Week In Review: Design, Low Power

By Jesse Allen - 06 May, 2022 - Comments: 0

Rambus will acquire Hardent, a provider of design services and IP. Rambus said Hardent's silicon design, verification, compression, and Error Correction Code (ECC) expertise will provide key resources for the Rambus CXL Memory Interconnect Initiative. “Driven by the demands of advanced workloads like AI/ML and the move to disaggregated data center architectures, industry momentum for CXL-base... » read more

Week In Review: Design, Low Power

By Jesse Allen - 11 Oct, 2019 - Comments: 0

M&A Dialog Semiconductor will acquire Creative Chips for approximately $80 million cash, with contingent consideration of up to $23 million. The move will expand Dialog's Industrial IoT portfolio, adding Creative Chips' industrial Ethernet and other mixed-signal products for connecting large numbers of IIoT sensors to industrial networks. Based in Bingen, Germany, Creative Chips was founded in... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Motor Design Limited

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Design, Low Power

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