Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 29 May, 2020 - Comments: 0

An effort to fund U.S. science and technology initiatives with at least $100 billion is getting a thumbs up from the SIA (Semiconductor Industry Association). The Endless Frontier Act — a bipartisan, bicameral bill introduced on Thursday in the U.S. House of Representatives — will invest money into semiconductor research and development and other related fields such as material science, q... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 28 Feb, 2020 - Comments: 0

AI/Edge The United States Department of Defense (DOD) has adopted ethical principles for using artificial intelligence in warfare that chiefly say the U.S. has to follow the laws, treaties, in use of AI in warfare. Any AI used by DOD has to be responsible, equitable, traceable, reliable and governable. “The Department will design and engineer AI capabilities to fulfill their intended functio... » read more

System Bits: April 4

By Ann Mutschler - 04 Apr, 2017 - Comments: 0

Nanodevices for extreme environments in space, on earth Researchers at the Stanford Extreme Environment Microsystems Laboratory (XLab) are on a mission to conquer conditions such as those found on Venus: a hot surface pelted with sulfuric acid rains, 480 degrees C, an atmosphere that would fry today’s electronics. By developing heat-, corrosion- and radiation-resistant electronics, the team ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NASA Ames Research Center

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

System Bits: April 4