Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

DAC 2020 Day One


DAC 2020 is like no other Design Automation Conference. It is virtual for this year — and hopefully only this year. The COVID pandemic has proven that face-to-face meetings and conferences are invaluable for many reasons. But with none of the distractions of a traditional conference, focusing on the content was easy. And because the sessions have been pre-recorded, the speakers for each se... » read more

Startup Funding: May 2020


It was a good month for semiconductor startups, with investment spanning a larger company in later funding rounds to brand new seed funding for two chip manufacturing startups. Two AI hardware startups bridge data center and edge, plus EV companies around the world get funding. In total, the eighteen startups profiled this month raised $446.3 million. Semiconductor & design Shanghai-based ... » read more

Week in Review – IoT, Security, Autos


Products/Services Arm and Swift Navigation will collaborate on providing technology to developers of autonomous vehicles and connected cars. San Francisco-based Swift Navigation, which offers Global Navigation Satellite System positioning technology for AVs, is teaming with the chip design company to offer Swift’s solutions as an option on Arm-based platforms, the companies say. Swift’s St... » read more

Week In Review: Design, Low Power


M&A ANSYS will acquire Livermore Software Technology Corp. (LSTC), a provider of explicit dynamics and other advanced finite element analysis technology. Based in Livermore, CA, LSTC was founded in 1987 to commercialize the DYNA3D technology developed at the Lawrence Livermore National Laboratory. DYNA3D became the company's premier product LS-DYNA, a general purpose nonlinear finite eleme... » read more