Preparing For 3D IC Stacking


By David Lammers Through-silicon vias (TSVs) are in various stages of late development, but design and manufacturing challenges remain before companies can gain the full benefits of the third dimension. Two camps are pushing hard to introduce TSVs—the design community and the manufacturing equipment companies. The initial goal is to connect graphics memories to graphics processors in mobi... » read more

Pulling Power Out Of Thin Air


By Cheryl Ajluni It wasn’t all that long ago that voice communication via a traditional landline was the norm. At the time, consumers would have been hard pressed to imagine a world in which anytime, anywhere communication (voice and data) with a device no bigger than the human hand was possible. Many of those same consumers might today find it hard to conceive of a world in which their... » read more

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