The Week In Review: Manufacturing

By Mark LaPedus - 02 Dec, 2016 - Comments: 0

Manufacturing There are more changes at SEMI. SEMI has named David Anderson as president of the SEMI Americas region. Most recently, Anderson was chief executive and chairman of Novati, a specialty manufacturing fab. He replaces Karen Savala, who was president of the SEMI Americas region for six years. In an e-mail, Savala confirmed she left SEMI in October. Meanwhile, in October, SEMI an... » read more

Manufacturing Bits: July 14

By Mark LaPedus - 14 Jul, 2015 - Comments: 0

Exploring the proton It took 23 years to conduct the experiments, but physicists have finally provided detailed results about the proton. The Deutsches Elektronen-Synchrotron (DESY) organization conducted the experiments within its particle accelerator from 1992 to 2007. The experiments took place in DESY’s Hadron Electron Ring Accelerator (HERA), an electron-proton collider. Then, ove... » read more

Time To Revisit 2.5D And 3D

By Mark LaPedus - 17 Apr, 2014 - Comments: 2

Chipmakers are reaching various and challenging inflection points. In logic, many IC makers face a daunting transition from planar transistors at 20nm to finFETs at 14nm. And on another front, the industry is nearing the memory bandwidth wall. So perhaps it’s time to look at new alternatives. In fact, chipmakers are taking a hard look, or re-examining, one alternative—stacked 2.5D/3D chi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Novati

The Week In Review: Manufacturing

Manufacturing Bits: July 14

Time To Revisit 2.5D And 3D