Manufacturing Bits: May 10

By Mark LaPedus - 10 May, 2021 - Comments: 0

Synaptic transistors The University of Hong Kong and Northwestern University have developed an organic electrochemical synaptic transistor, a technology that could one day process and store information like the human brain. Researchers have demonstrated that the transistor can mimic the synapses in the human brain. It can build on memories to learn over time, according to researchers. Th... » read more

Neuromorphic Computing: Modeling The Brain

By Katherine Derbyshire - 15 Jun, 2017 - Comments: 8

Can you tell the difference between a pedestrian and a bicycle? How about between a skunk and a black and white cat? Or between your neighbor’s dog and a colt or fawn? Of course you can, and you probably can do that without much conscious thought. Humans are very good at interpreting the world around them, both visually and through other sensory input. Computers are not. Though their sheer... » read more

Inside AI And Deep Learning

By Mark LaPedus - 21 Jan, 2016 - Comments: 0

Semiconductor Engineering sat down to talk with Dave Schubmehl, research director for content analytics, discovery and cognitive systems at International Data Corp. (IDC), a market research firm. Schubmehl’s research covers information access, artificial intelligence, cognitive computing, deep learning, machine learning and other topics. He also addressed neuromorphic technology. What follows... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Manufacturing Bits: May 10

Neuromorphic Computing: Modeling The Brain

Inside AI And Deep Learning