New Technologies To Support 3D-ICs


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

EDA Gears Up For 3D


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Chiplets: Open Market or Joint Venture?


By Dr. Carlos Macián, senior director AI Strategy & Products, eSilicon Corporation “It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected.” — Gordon Moore, 1965 “Chiplet” has become a buzzword and like most of its kind, the success of the buzzword predates the widespread availability of the produ... » read more

High-Speed Communications: On The Road Again


Lately, we’ve had quite a lot of trade show participation. I discussed ISSCC last month. I will be careful right now to state that ISSCC is a technical conference and not a trade show. The organizers are quite particular about that. Nonetheless, we were invited to demonstrate our high-speed SerDes there, and we got a lot of great questions from a lot of very smart people. Since ISSCC, we... » read more

Week in Review: IoT, Security, Auto


Internet of Things Apple purchased a portfolio of eight granted and pending patents that belonged to Lighthouse AI, a smart home security camera startup that ceased operations near the end of 2018. The portfolio was acquired at about the same time, according to the U.S. Patent & Trademark Office; financial terms weren’t revealed. Also not disclosed, as usual, is what Apple will do with t... » read more

Mixing Interface Protocols


Continuous and pervasive connectivity requires devices to support multiple interface protocols, but that is creating problems at multiple levels because each protocol is based on a different set of assumptions. This is becoming significantly harder as systems become more heterogeneous and as more functions are crammed into those devices. There are more protocols that need to be supported to ... » read more

The Internet Of Cores


Ever since the birth of the third-party [getkc id="43" comment="IP"] market, there has been a desire for plug-and-play compatibility between cores. Part of the value proposition of reuse is that a block has been used before, and has been verified and validated by having been implemented in silicon. By re-using the core, many of these tasks no longer land on the [getkc id="81" kc_name="SoC"] dev... » read more

Blog Review: Oct. 22


What is UX? The User Experience, of course. Rambus' Aharon Etengoff notes that the IoT UX is now the subject of a Harvard Business Review article. A long list of hurdles are expected at the 10nm process node, including multiple levels of local interconnects, more complex layout rules, timing problems, and a slew of others. Cadence's Richard Goering puts it all in perspective. Mentor's R... » read more

Standards Watch


This may sound odd to anyone outside of the SoC world, but as more functionality and more components move from PCB to chip—or at least the same package—what’s happening in the standards world is mirroring what’s going on in semiconductor design and manufacturing. The rule of thumb in the standards world is that as new techniques and technologies are introduced, the number of standard... » read more

Standards Update


By Ann Steffora Mutschler In the sometimes-murky waters of system-level modeling standards where real-world adoption can be difficult to track, work is progressing to help hardware and software engineers realize the promise of true hardware-software codesign. The three main standards efforts related to modeling at the system level are OSCI’s TLM-2.0, OCP-IP’s OCP and Open Modeling TAB a... » read more

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