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The Need For Open Molded Plastic Packages


When you need to meet a project or customer deadline, can you count on your outsourced semiconductor assembly and test (OSAT) provider to get you the parts when you need them? If the answer is “no” or “it depends,” you’ll understand the value of having open molded plastic packages – plastic packages with open cavities – readily available for quick-turn assembly. OSATs are v... » read more

Shortages, Challenges Engulf Packaging Supply Chain


A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more