Week In Review: Design, Low Power

By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 08 Apr, 2022 - Comments: 0

Automotive, mobility Qualcomm completed its acquisition of Arriver Business from SSW Partners. Arriver’s Driver Assistance, Computer Vision, and Drive Policy assets will become part of the Snapdragon Ride Platform. SSW Partners, a New York-based investment partnership, has acquired all shares in Veoneer, retaining its Tier-1 supplier and integrator businesses. Hyundai Motor Group gave Inf... » read more

October ’19 Startup Funding: Mega Harvest

By Jeff Dorsch - 11 Nov, 2019 - Comments: 0

Seventeen startups took in mega-rounds of $100 million or more during October, with a cumulative total of just over $3.2 billion. Cybersecurity startups continued to be popular with private investors during the month of October, with 15 financing rounds. Twenty automotive and mobility technology firms picked up new investments. Analytics firms, artificial intelligence/machine learning techno... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Pensando Systems

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

October ’19 Startup Funding: Mega Harvest