Week In Review: Design, Low Power

By Linda Christensen - 25 Aug, 2023 - Comments: 0

Arm filed its registration statement for a highly anticipated IPO. Chip industry heavyweights Apple, Samsung, NVIDIA, and Intel are all expected to invest. Find the SEC filing here. Taiwan’s National Science and Technology Council (NSTC) laid out a 10-year initiative to bolster its IC design market share to 40% worldwide by 2033, with the first year’s budget of US $376 million. The sh... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 25 Aug, 2023 - Comments: 0

The AI chip market is booming. Gartner expects revenue for the year will hit $53.4 billion, up 20.9% from 2022. The firm predicts that number will grow to $119 billion by 2027. In the consumer electronics market, the value of AI-enabled application processors will amount to $1.2 billion in 2023, up from $558 million in 2022. Germany will spend nearly €1 billion (~US$1.7B) over the next t... » read more

Week In Review: Manufacturing, Test

By Karen Heyman - 25 Aug, 2023 - Comments: 0

Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, per Nikkei Asia. Huawei is building a collection of secret semiconductor fabrication facilities across China to let the company skirt U.S. sanctions, SIA warned in a presentation seen by Bloomberg. It’s acquired at least two existing plants and is building at l... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

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