Challenges And Outlook of Photonic-Integrated Circuit Packaging (Hanyang Univ.)


A new technical paper titled "Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging" was published by researchers at Hanyang University. Excerpt "This review discusses the latest developments in photonic integrated chip packaging at the component, chip, and system levels. It also highlights the current issues and challenges of these technologies and provides futur... » read more

Integration of High-Density Polymer Waveguides With Silicon Photonics for CPO (imec, Ghent)


A technical paper titled "Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics" was published by researchers at imec and Ghent University. Abstract "Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coup... » read more