tag: POLYN Technology

Chip Industry Week in Review

By The SE Staff - 31 Oct, 2025 - Comments: 0

San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Chip Industry Week In Review

By The SE Staff - 22 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Trending Articles

The Sub-2nm Paradox

Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.

Flash Getting Stacked High-Bandwidth Version

Inspired by HBM, HBF could improve AI efficiency in 3D flash memory.

Chiplets Need A New Workflow

Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to identify risks early and scale reliably.

by Ann Mutschler

Chip Industry Week In Review

Taiwan, Europe packaging buildout; 2nm ramps; quantum big $; 2 new university hubs; agent honeypots; Samsung strike averted; extreme environment chip design; quantum-dot qubit device fabricated w/high-NA EUV; EU flagship power electronics project; CNTs.

by The SE Staff

Chip Industry Week in Review

Tata-ASML deal; what happened to H200 chips for China? $1.5T IC industry by 2030; new funding; AI memory tools; MRC spec; embedding solar chips in windows; Ford launches battery biz; Waymo does the backstroke; UMC's high-voltage finFET.

by The SE Staff

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The Sub-2nm Paradox

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