Week In Review: Manufacturing, Test

By Mark LaPedus - 25 Feb, 2022 - Comments: 0

Chipmakers, OEMs UMC plans to build a new fab next to its existing 300mm fab in Singapore. The new fab, called Fab12i P3, will manufacture wafers based on UMC’s 22nm/28nm processes. The planned investment for this project will be $5 billion. The first phase of this greenfield fab will have a monthly capacity of 30,000 wafers with production expected to commence in late 2024. To account fo... » read more

Startup Funding: September 2020

By Jesse Allen - 01 Oct, 2020 - Comments: 0

It was a good month for startups, with big rounds in automotive, data centers, and AI. A new startup with big backing is taking aim at energy inefficiency in the data center, and another is looking to make the industrial IoT battery-free. SK Hynix founded a new company to analyze semiconductor manufacturing data, and one of China's EV companies sees a massive cash infusion. This month, we look ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 28 Feb, 2020 - Comments: 0

AI/Edge The United States Department of Defense (DOD) has adopted ethical principles for using artificial intelligence in warfare that chiefly say the U.S. has to follow the laws, treaties, in use of AI in warfare. Any AI used by DOD has to be responsible, equitable, traceable, reliable and governable. “The Department will design and engineer AI capabilities to fulfill their intended functio... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: PragmatIC

Week In Review: Manufacturing, Test

Startup Funding: September 2020

Week In Review: Auto, Security, Pervasive Computing

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Entities, people and technologies explored