tag: Rambus

The Next Big Threat: Power And Performance
By Ed Sperling - 17 Jan, 2014 - Comments: 3

In the shiny world of consumer electronics and powerful computers, taking a grinder to the outside of a package may sound more like safecracking than sophisticated electronic code hacking. The reality is there is more in common than most semiconductor companies would like to admit, and the starting point often is just as crude. To no small extent, systems on chip have become miniature safes.... » read more

Straight Talk On 3D TSVs
By Ed Sperling - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 3D device challenges and applications with John Lau, a fellow at the Industrial Technology Research Institute (ITRI), a research organization in Taiwan. SMD: What is ITRI doing in 3D TSVs? Lau: At ITRI we have developed the world’s first Applied Materials’ 300mm (3D TSV) integration line. The line was comple... » read more

Designing into A Foundry Low-Power High-k Metal Gate 28nm CMOS Solution
By Various Writers - 31 Jul, 2012 - Comments: 0

28nm Super Low Power is the low power CMOS offering delivered on a bulk silicon substrate for mobile consumer and digital consumer applications. The 28nm process technology is slated to become the foundation for a new generation of portable electronics that are capable of handling streaming video, data, voice, social networking and mobile commerce applications. To view this white paper, clic... » read more

The Challenges Of 28nm HKMG
By Various Writers - 26 Jun, 2012 - Comments: 0

28nm Super Low Power (28nm-SLP) is the low power CMOS offering delivered on a bulk silicon substrate for mobile consumer and digital consumer applications. This technology has four Vt's (high, regular, low and super low) for design flexibility with multi-channel length capability and offers the ultimate in small die size and low cost. Multiple SRAM bit cells for high density and high-performanc... » read more

Power Trip Advisor
By Ed Sperling - 12 Nov, 2009 - Comments: 0

By Geoffrey James There’s never been a greater demand for power-efficient silicon. As consumer electronic devices get smaller, with increased functionality, battery power becomes a premium resource. At the same time, “Green IT” is a major corporate trend, and the best way to be environmentally sensitive (while saving on energy costs) is to buy technology that ekes the maximum computing o... » read more

Multicore Meets Multichannel Memory
By Ed Sperling - 08 Oct, 2009 - Comments: 0

Rambus Fellow Craig Hampel talks with System-Level Design about the next bottlenecks in high-performance computing and how to solve them. [youtube vid=jbNg1xdZUoU] » read more

When It Comes To Intellectual Property, Size Matters
By Various Writers - 19 Aug, 2009 - Comments: 0

By Geoffrey James Intellectual property was once seen as the new growth market for EDA. Dozens of firms – large and small – jumped on the IP bandwagon, attracted to the “build once, sell many times” business model. “As late as 2004, the industry was still thinking that as much as 90% of SoCs would be reused IP,” said EDA consultant Gary Smith. The IP segment, however, hasn�... » read more

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