One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging Using a Photosensitive Dielectric Material


Authors: Warren W. Flack, Robert Hsieh, Ha-Ai Nguyen Ultratech, a division of Veeco 3050 Zanker Road, San Jose, CA 95134 USA [email protected] John Slabbekoorn, Samuel Suhard, Andy Miller IMEC Kapeldreef 75 B-3001 Leuven, Belgium [email protected] Akito Hiro, Romain Ridremont JSR MICRO NV Technologielaan 8 B-3001 Leuven, Belgium [email protected] Abstract This... » read more

Inspecting IC Packages Using Die Sorters


The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools in the in-line production flow, but it also now requires new die sorting equipment with advanced inspection capabilities. Die sorters are not the kind of equipment that typically attracts attenti... » read more