Week In Review: Manufacturing, Test

By Mark LaPedus - 17 Jul, 2020 - Comments: 0

Chipmakers TSMC posted mixed results in the quarter, although the news was generally positive. The foundry giant raised its capital spending plans. “Our second quarter business was sequentially flat, as the continued 5G infrastructure deployment and HPC-related product launches offset weaknesses in other platforms,” said Wendell Huang, vice president and CFO at TSMC. “Moving into third q... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Jul, 2020 - Comments: 0

Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

The Week in Review: IoT

By Jeff Dorsch - 02 Mar, 2018 - Comments: 0

Finance CyberX raised $18 million in Series B funding, bringing its total funding to $30 million. Norwest Venture Partners led the new round and was joined by ff Venture Capital, Flint Capital, Glilot Capital Partners, and OurCrowd. CyberX makes its headquarters in Framingham, Mass., with operations in Israel. The startup offers security protection for Industrial Internet of Things application... » read more

The Week in Review: IoT

By Jeff Dorsch - 08 Dec, 2017 - Comments: 0

Products/Services Vancouver, B.C.-based Riot Micro has brought out the RM1000 baseband modem chip for the cellular Internet of Things. The device is said to use Bluetooth Low Energy and Wi-Fi techniques to provide low-power and lower-cost connectivity, like short-range wireless systems. The chip is being marketed to module manufacturers and OEMs developing narrowband IoT and LTE-M products for... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Riot Micro

Week In Review: Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

The Week in Review: IoT

The Week in Review: IoT

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