Hybrid Memory Cube – Ready For Prime Time


With the release this week of Hybrid Memory Cube (HMC) 2.0, designers can get their hands on mature, standards-based IP that can be used to significantly scale the performance of servers and data centers. HMC offers bandwidths up to 320 GB/s – 12X that of standard memory solutions like DDR4 – while consuming significantly less power. These benefits are too significant to ignore for ASIC, So... » read more

The Week In Review: Manufacturing


Intel’s McAfee unit announced its annual “12 Scams of the Holidays” list to educate the public on the most popular ways cybercriminals scam consumers during the holiday season. The German government has cleared Applied Materials’ proposed acquisition of Tokyo Electron Ltd. (TEL). The merger is still under examination by the competition authorities in the U.S., South Korea, Japan, Tai... » read more

Will Materials Derail Moore’s Law?


Is Moore’s Law slowing down? Clearly, chipmakers are struggling to keep up with Moore’s Law these days. But one sometimes forgotten and critical technology could easily derail Moore’s Law--materials. In fact, the cost and complexity for electronic materials are increasing at each node. “Chemical and gas commodity procurement spends are growing rapidly due to process complexity and un... » read more

The Week In Review: Design


IP Cadence rolled out a portfolio of stacked die memory verification IP to support Wide I/O-2, Hybrid Memory Cube, high-bandwidth memory, and DDR4-3DS. Included are direct memory access for read, write, save, preload and comparison of memory contents, assertions, error configurability, and a built-in address manager. ARM rolled out additions to its enterprise-class SoC interconnects for qua... » read more

The Week In Review: Manufacturing


It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

Time To Look At SOI Again


Chipmakers have the luxury of looking at several process options when developing chips at the 28nm node and beyond. Using bulk CMOS, for example, chipmakers can scale planar transistors down to 20nm. Then, at 20nm, planar runs out of gas due to the so-called short-channel effect. At that point, IC makers must migrate towards finFETs at 16nm/14nm and beyond. Another process option is fully... » read more

The Week In Review: Manufacturing


Samsung Electronics signed a memorandum of understanding to construct a new semiconductor fab in the company’s Godeok Industrial Complex in Pyeongtaek. The construction of the new semiconductor fabrication plant will begin during the first half of 2015, and operations are scheduled to begin sometime during the second half of 2017. United Microelectronics Corp. (UMC) will participate in a t... » read more

The Week In Review: Manufacturing


Jimmy Kimmel, comedian and late night host of Jimmy Kimmel Live, replaces Lily Collins (Mirror, Mirror) as McAfee’s most dangerous celebrity to search for online. Cybercriminals are looking for ways to take advantage of consumer interest around popular cultural events. These criminals capitalize on the public’s fascination with celebrities to lure them to sites laden with malware, which ena... » read more

The Week In Review: Manufacturing


Is the sky falling on the ATE market? The ATE market is expected to hit $2.8 billion in 2014, up from $2.28 billion in 2013, according to Pacific Crest Securities. “Overall, we are now modeling overall semiconductor test demand to decline by 2% in 2015, a significant change from our previous estimate of up 10%,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “Te... » read more

How Reliable Is Your IP?


Almost everyone who has bought a new smartphone, car, home electronics device or appliance either has experienced technical glitches that require a replacement or repair, or they know someone who has experienced these problems. The good news is that only a very small fraction of the electronic glitches or failures can be contributed to hardware design. Most of it is due to manufacturing vari... » read more

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