tag: Samsung

3D NAND Metrology Challenges Growing
By Mark LaPedus - 09 Apr, 2019 - Comments: 8

3D NAND vendors face several challenges to scale their devices to the next level, but one manufacturing technology stands out as much more difficult at each turn—metrology. Metrology, the art of measuring and characterizing structures, is used to pinpoint problems and ensure yields for all chip types. In the case of 3D NAND, the metrology tools are becoming more expensive at each iteration... » read more

Spreading Intelligence From The Cloud To The Edge
By Kevin Fogarty and Ed Sperling - 04 Apr, 2019 - Comments: 0

The challenge of partitioning processing between the edge and the cloud is beginning to come into focus as chipmakers and systems companies wrestle with a massive and rapidly growing volume of data. There are widely different assessments of how much data this ultimately will include, but everyone agrees it is a very large number. Petabytes are simply rounding errors in this equation, and tha... » read more

System Bits: April 2
By Jeff Dorsch - 02 Apr, 2019 - Comments: 0

Transparent film is stronger than aluminum Professor Ton Peijs of WMG at the University of Warwick and Professor Cees Bastiaansen at Queen Mary University of London came up with a new processing technique that produces a transparent polythene film said to be stronger than aluminum. The film could be used in displays, glazing, visors, and windshields, without adding significant weight. The d... » read more

Single Vs. Multi-Patterning EUV
By Mark LaPedus - 25 Mar, 2019 - Comments: 5

Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Mar, 2019 - Comments: 0

Chipmakers TrendForce released its foundry rankings for the first quarter of 2019. TSMC is still the clear leader, followed in order by Samsung, GlobalFoundries and UMC, according to the firm. It was a tough quarter for all foundries. Samsung has rolled out its new High Bandwidth Memory (HBM2E) product. The new solution, called Flashbolt, is the industry’s first HBM2E to deliver a 3.2Gbps... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 Mar, 2019 - Comments: 0

Synopsys announced several new products: a new test family, a physical verification solution, and a software library for neural net SoCs. TestMAX, the new family of test products, includes soft error analysis and X-tolerant logic BIST for automotive test and functional safety requirements. TestMAX enables test through functional high-speed interfaces and supports early validation of DFT logi... » read more

Slow And Cautious Start To 2019 For Memory Manufacturers
By Adrienne Downey - 21 Mar, 2019 - Comments: 0

Both NAND and DRAM prices began dropping in the second half of 2018 after a couple years at record highs. Product oversupply and excess inventories are signaling a bleak outlook for the memory market in the first half of 2019. With these conditions in mind, SK Hynix and Samsung have slowed or put on hold their plans for capacity expansion in 2H18 and 2019. The chart below shows DRAM capacity... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Mar, 2019 - Comments: 0

Chipmakers How bad is the slowdown in the IC industry? The memory market is terrible, while other markets are slowing. One company—Renesas--is feeling the brunt. Citing the IC slowdown, Renesas will temporarily halt production at 13 of the company's 14 production facilities, according to a report from Nikkei. Renesas confirmed the move. “Renesas is considering implementing measures to ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Mar, 2019 - Comments: 1

Trade Trade tensions between the United States and China continue. The U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. This was the week that the U.S. was supposed to raise tariffs by 25%. I... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Feb, 2019 - Comments: 0

Chipmakers IC Insights has released the process technology roadmaps for chipmakers and foundries. GlobalFoundries, Intel, Samsung, SMIC, TSMC and UMC are highlighted. GlobalFoundries has announced that the company’s 8SW RF SOI technology has delivered more than a $1 billion of client design win revenue since its launch in 2017. RF SOI is designed for RF switches and other devices in 4G/... » read more

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