Manufacturing Bits: Feb. 7

By Mark LaPedus - 07 Feb, 2022 - Comments: 0

Design tools for solid-state batteries Oak Ridge National Laboratory has devised a new tool designed to accelerate the development of energy-dense solid-state batteries. The tool, called the Solid-State Battery Performance Analyzer and Calculator (SolidPAC), enables researchers to assess the impact of battery designs and choice of cell components for solid-state batteries. It can be used to... » read more

Manufacturing Bits: Nov. 24

By Mark LaPedus - 24 Nov, 2021 - Comments: 0

Tiny MEMS gyroscope CEA-Leti and Politecnico di Milano (POLIMI) have developed the world’s smallest MEMS gyroscope. Based on a nano-resistive sensing technology, the gyroscope enables a navigation-grade performance with a sensor footprint of only 1.3mm2. The tiny gyroscope is targeted for high-volume markets like automotive and others. The technology was reported in a paper, entitled “1... » read more

Manufacturing Bits: Jan. 28

By Mark LaPedus - 28 Jan, 2020 - Comments: 0

Fast photography The California Institute of Technology has developed a high-speed camera that can take pictures of transparent objects. The technology, called phase-sensitive compressed ultrafast photography (pCUP), can take up to 1 trillion pictures per second of transparent objects. Potentially, the technology from Caltech could be used in several applications, such as taking photos of s... » read more

Knowledge Centers
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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Science Advances

Manufacturing Bits: Feb. 7

Manufacturing Bits: Nov. 24

Manufacturing Bits: Jan. 28

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