tag: SEMI

Successful FlexTech Integration Providing New Opportunities for SEMI Members
By SEMI - 23 Jun, 2016 - Comments: 0

By Michael Ciesinski, President, FlexTech In 2014, SEMI developed a new model – SEMI Strategic Association Partnership – for engaging other associations and organizations in a strategic, long-term relationship that supports and advances the interests of SEMI members in emerging and adjacent segments of the electronics supply chain. The strategic partner brings a community, brand, and pro... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Jun, 2016 - Comments: 0

Chipmakers It’s been a difficult time for Intel. The chip giant recently announced a major layoff. It also ceased development on several cell-phone chip products. Intel hasn’t given up on Moore’s Law, but the nodes appear to be extending from 18 to 24 months or perhaps longer, at least at Intel. Here’s the latest: For 10nm production, Intel received the production fab tools in Ap... » read more

How To Build Systems In Package
By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

Pathfinding Beyond FinFETs
By Paula Doe - 13 Jun, 2016 - Comments: 0

Though the industry will likely continue to find ways to extend CMOS finFET technology further than we thought possible, at some point in the not-so-distant future, making faster, lower power ICs will require more disruptive changes. For something that could be only five to seven years out, there’s a daunting range of contending technologies. Improvements through the process will help, from E... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jun, 2016 - Comments: 0

MEMS manufacturing A*STAR’s Institute of Microelectronics (IME) in Singapore has launched its third consortium to develop MEMS technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and a smaller form factor. The MEMS Consortium III consists of the following companies: Applied Materials, Coventor, Delta Electronics, GlobalFoundries, InvenS... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 May, 2016 - Comments: 0

Fab tools Thermo Fisher Scientific and FEI have announced that their boards of directors have unanimously approved Thermo Fisher’s acquisition of FEI for $107.50 per share in cash. The transaction represents a purchase price of approximately $4.2 billion. In a video, Aki Fujimura, chief executive of D2S, recaps the emerging mask and lithography trends presented at the recent Photomask Ja... » read more

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 May, 2016 - Comments: 0

Chipmakers IC Insights released its top chip makers in terms of sales for the first quarter of 2016. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and six fabless companies. Intel remained in the top spot, followed in order by Samsung and TSMC. The biggest movers in the ranking were made by the new Broadcom (Avago/Broadcom) and Nvidia. Broadcom jumped f... » read more

Russian Market Overview
By SEMI - 19 May, 2016 - Comments: 0

By Evgeny Suvorov The Russian market has turned towards the Internet of Things (IoT), with several projects underway, particularly in the areas of agriculture and mining. The largest of these projects have been initiated and backed by the state.  The most striking example is probably the introduction of the "Platon" system, an IoT-based road levy collection system comprised of on-board unit... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 May, 2016 - Comments: 0

Chipmakers Samsung Electronics has unveiled its newest memory card globally–the EVO Plus 256GB microSD card. Based on Samsung’s 3D NAND technology, the EVO Plus 256-GB offers the highest capacity for a microSD card in its class. Consumers can now record up to 12 hours of 4K UHD video or 33 hours of Full HD video on their mobile device or action camera without needing to change or replace t... » read more

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