tag: SEMI

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jun, 2014 - Comments: 0

According to one analyst, the capital spending picture looks gloomy. “We expect finFET and 3D NAND to ramp over the next two years. However, foundry and memory customers are showing great restraint with respect to spending plans, limiting the rate of new node transitions and overall capex upside. In the near term, we see no evidence of meaningful equipment orders to support high-volume finFET... » read more

SEMICON West Preview: Test
By Paula Doe - 19 Jun, 2014 - Comments: 0

Talking with the speakers scheduled to speak in the programs on IC testing at SEMICON West this year, I was struck by how much this equipment sector is changing as the value moves to software and the cloud. It has to be the first time I’ve ever mentioned PayPal in the same paragraph with semiconductor equipment, to say nothing of the business model of free hardware with software subscription.... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Jun, 2014 - Comments: 0

In a much-anticipated deal, IBM is close to selling its chip unit to GlobalFoundries, according to Bloomberg. GlobalFoundries wants IBM’s engineers and the IP, and not the fabs. Intel lost its challenge against a record 1.06 billion euro ($1.44 billion) European Union fine handed down five years ago, according to Reuters. The EU said Intel tried to thwart AMD by giving rebates to PC makers... » read more

Semicon West Preview: Packaging
By SEMI - 09 Jun, 2014 - Comments: 0

By Paula Doe The evolving mobile device market means the packaging, assembly and test supply chain faces a growing range of alternative technologies vying for its investment dollar, everything from Google’s modular electronics with 3D printing, to more solutions for integrating varied chips in smaller packaged systems. One potentially disruptive change is the wider use of more open-source... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Jun, 2014 - Comments: 0

To help fab tool vendors, Imec has formally launched what it calls a “suppliers hub.” This program aims to offer an open R&D platform, which enables chip suppliers and tool makers to collaborate more deeply and in an earlier stage in the process. D2S has acquired the assets of Gauda, a developer of GPGPU-based computational lithography acceleration technology headquartered in Sunnyvale,... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 May, 2014 - Comments: 1

About 150 to 200 employees from IBM’s chip unit will be dispatched to work at GlobalFoundries, according to the Poughkeepsie Journal. GlobalFoundries said the arrangement is temporary, according to the report. GlobalFoundries is the leading candidate to buy IBM’s chip unit, which is apparently on the block. To date, however, GlobalFoundries and IBM have yet to make any announcements on the... » read more

Blog Review: May 21
By Ed Sperling - 21 May, 2014 - Comments: 0

Mentor’s Colin Walls offers up some new insights into C++ exception handling, thanks to some input from colleague Jonathan Roelofs. This one involves minimizing overhead and reducing runtime penalties. Synopsys’ Mick Posner is back in the saddle again—literally. This is about as green as it gets. Cadence’s Arthur Marris reports back on the IEEE 802.3 Ethernet standards meeting, in... » read more

Is 450mm Dead In The Water?
By Mark LaPedus - 15 May, 2014 - Comments: 3

At one time, Intel, TSMC and Samsung were aggressively beating the 450mm drum. Chipmakers wanted, if not demanded, 450mm pilot line fabs by 2016, with high-volume manufacturing 450mm plants slated by 2018. At least for those companies, 450mm made some sense. Moving to 450mm wafers would supposedly give chipmakers a 2.25x boost in wafer area and a 30% cost reduction over 300mm substrates. But... » read more

What’s Next For MEMS
By SEMI - 15 May, 2014 - Comments: 0

By Paula Doe While MEMS sensors and actuators are key to enabling most of the high profile markets of tomorrow, from wearables to smart objects in the Internet of Things, MEMS companies face challenges today in transitioning to those new opportunities as basic MEMS devices increasingly becoming commodities. Large corporations are hiring their own in-house MEMS engineers, as standard platforms ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 May, 2014 - Comments: 0

Samsung Electronics announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips, dubbed 3D V-NAND. A recent chemical leak at Intel’s fab in Arizona was contained and two workers were taken to a hospital for observation, according to reports. Apparently, Intel was i... » read more

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