Week In Review: Manufacturing, Test

By Mark LaPedus - 19 Apr, 2019 - Comments: 0

Chipmakers Here comes the battle between 5nm and 6nm processes at two foundry vendors—Samsung and TSMC. Meanwhile, Intel is behind and scrambling to get 10nm out the door. (Intel's 10nm is equivalent to 7nm from the foundries.) Last week, TSMC announced delivery of a complete version of its 5nm design infrastructure. TSMC’s 5nm technology is based on a finFET. This week, Samsung anno... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 08 Mar, 2019 - Comments: 0

Internet of Things Dialog Semiconductor is shifting its product portfolio away from smartphones following its pending $600 million deal with Apple. The chip company is looking toward connected-health products and video-game consoles for future growth. The connected-health devices, developed in collaboration with pharmaceutical firms, would monitor blood pressure and check glucose levels, accor... » read more

Full Steam Ahead For China Inc.

By Joanne Itow - 19 Mar, 2015 - Comments: 1

Were you in Shanghai this week? If not, you missed the biggest Semicon event in the world. Semicon China broke records this year. With more than 1,000 companies participating, and 570,000 square meters of exhibition space, Semicon China attracted more than 50,000 visitors, making it the largest Semicon event in the world. All the sessions we attended were standing room only. Key areas of fo... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Semicon China

Week In Review: Manufacturing, Test

Week in Review: IoT, Security, Auto

Full Steam Ahead For China Inc.