More People Use Phones Than Toothbrushes…


“Business Has Only Two Functions – Marketing and Innovation” — Milan Kundera There may be more to running a successful business than marketing and innovation, but these two functions were front-and-center at SEMICON West 2014. This year’s industry gathering was an important, and positive, step forward together. Because of the gravity of the challenges facing our industry – funda... » read more

EUV Is Key To 450mm Wafers


Whether the wafers in question are 200 mm in diameter, or 300 mm, or potentially 450 mm, larger wafer sizes have always been justified by manufacturing economics. If the cost to process a wafer stays the same, but the wafer contains more devices, then the cost per device goes down. For processes that apply to the entire wafer at once — etch, deposition, cleaning, and so forth — the equation... » read more

Next-Generation Sustainability Gets More Challenging


The semiconductor industry has made major progress on reducing energy usage and water consumption, and effectively abating its emissions, as companies made sustainability a core requirement in their design of new processes and tools. But it’s about to get considerably harder. That means more opportunities to add value with innovative technologies, and also more need for collaboration. Next... » read more

Mid-Year Market Review: A Tale Of Two Halves


The month of July brings 110-degree weather to Phoenix and a welcome trip to San Francisco for Semicon West. It also means the year is half over and it’s time to assess mid-year market dynamics. Spirits were high last week at Semicon West. Most equipment vendors made significant revenue gains in the first half of 2014 and expect the second half of the year to be just as good or even bette... » read more

3D Printing: Can You Imagine the Possibilities?


3D printing is being used in many more applications than most people realize. But the most exciting applications for 3D printing are the ones that haven’t even been conceived of yet. It’s exciting to realize we are on the cusp of a manufacturing revolution that affects so many different industries already. If you have been to the movies lately, you’ve likely seen 3D printing in action.... » read more

All Together Now!


Consolidation is changing the face of our industry. It is tempting to think that a narrower more consolidated industry is easier to navigate and might require less facilitated coordination and collaboration. However, it turns out the reverse is true. With fewer, but much bigger companies, the bets become exponentially bigger.  At the same time technical challenges — such as advanced tra... » read more

What Comes Next?


The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

Blog Review: June 25


Is the Amazon Fire smart phone a paradigm shift? Cadence’s Brian Fuller looks at the first application-specific smart phone and why it’s noteworthy—regardless of how well it fares against phones made by Apple and Samsung. Rambus’ Deepak Chandra Sekar digs deep into interconnect technology and where the prevailing winds are blowing—copper barrier/cap/liner optimization, a slowdown i... » read more

Semicon West Preview: Packaging


By Paula Doe The evolving mobile device market means the packaging, assembly and test supply chain faces a growing range of alternative technologies vying for its investment dollar, everything from Google’s modular electronics with 3D printing, to more solutions for integrating varied chips in smaller packaged systems. One potentially disruptive change is the wider use of more open-source... » read more

SEMICON West Preview


By Paula Doe The fast growing demand for bandwidth is driving telecomm and data center user interest in moving high speed optical connections closer and closer to the chips, as recent advances in packaging technology, from microbumping to bonding to wafer-level redistribution now help make it possible. Chip-to-chip and chip-to-board optical connections increasingly look like a viable soluti... » read more

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