tag: SemiWise

Chip Industry Week In Review

By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Chip Industry Week In Review

By The SE Staff - 22 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 12 May, 2023 - Comments: 0

Synopsys acquired Silicon Frontline Technology, a provider of an electrical layout verification solution for mixed-signal and analog designs, large-scale power semiconductor devices, and electrostatic discharge protection networks. "This acquisition enables Synopsys to extend the capabilities of our design analysis portfolio and help build out a system-level electrical analysis platform. We als... » read more

Trending Articles

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Chip Industry Week In Review

DAC; CHIPS funding; CXL standards; Nexperia investment; US curbs tech investments; Accellera's Federated Simulation Group; European sustainability concerns; SIA's tracking tool; Multibeam's multicolumn litho system.

by The SE Staff

Chip Industry Week In Review

Leading-edge foundry plans; DoD IC center; 300mm funding; Intel's apprenticeship program; metrology and test acquisitions; Keysight's chiplet PHY simulation; thermal management in 3D-ICs; foundry growth.

by The SE Staff

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

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Related Articles

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

by Laura Peters

The Race To Glass Substrates

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

by Gregory Haley

What Works Best For Chiplets

Not all chiplets are interchangeable, and options will be limited.

by Anne Meixner

Controlling Warpage In Advanced Packages

Mechanical stresses increase with larger sizes and heterogeneous materials.

by Laura Peters

Electrically Controlled All-AFM Tunnel Junctions on Silicon with Large Room-Temperature Magnetoresistance (Northwestern)

by Technical Paper Link

Architecting Chips For High-Performance Computing

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

by Ann Mutschler

EDA Looks Beyond Chips

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.

by Ed Sperling

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