Week In Review: Design, Low Power

By Jesse Allen - 11 Feb, 2022 - Comments: 0

Nvidia's proposed acquisition of Arm is officially off. The deal faced significant pushback from regulatory agencies in the UK, USA, and Europe, which feared it would reduce or limit competition in areas like data center. Nvidia indicated it would continue working with Arm, and it will retain a 20-year Arm license. (SoftBank will retain the $1.25 billion prepaid by Nvidia.) SoftBank said it wil... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 11 Jan, 2019 - Comments: 0

Internet of Things Automotive, health care, manufacturing, and the public sector could be transformed this year by Internet of Things technology, Bob Violino writes. Taqee Khaled, director of strategy at Nerdery, a digital business consultancy, predicts 2019 will see rapid evolution in enterprise IoT pilot initiatives and implementations. "This acceleration is due, in part, to advances in manu... » read more

Week In Review: Design, Low Power

By Jesse Allen - 11 Jan, 2019 - Comments: 0

M&A QuickLogic acquired SensiML Corporation. Founded in 2017 as a spin-off from Intel, SensiML provides a Software-as-a-Service suite for developing pattern matching sensor algorithms optimized for ultra-low power consumption using machine learning. Details of the deal were not disclosed, though QuickLogic will fund it with shares of common stock. IP CEVA debuted an all-purpose, hybrid... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SensiML

Week In Review: Design, Low Power

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power