tag: Siemens

Machine Learning Tools Help Bridge Design-To-Manufacturing Gap
By Katherine Derbyshire - 24 Jul, 2025 - Comments: 0

More aggressive feature scaling and increasingly complex transistor structures are driving a steady increase in process complexity, increasing the risk that a specified pattern may not be manufacturable with an acceptable yield. A single layer now requires more process steps, and each of those entails more tunable parameters than ever before. To help manage design risk, foundries provide det... » read more

Chip Industry Week in Review
By The SE Staff - 18 Jul, 2025 - Comments: 0

The U.S. government will grant licenses to NVIDIA and AMD to again sell some AI chips — NVIDIA's H20 GPU and AMD's MI308 — to Chinese companies. TrendForce projects that the availability of NVIDIA chips, in particular, will create a surge in demand from Chinese AI firms and cloud service providers, and boost high-bandwidth memory (HBM) consumption. The move could raise China’s share of... » read more

6G Rollout Will Be A Patchwork At First
By Liz Allan - 08 Jul, 2025 - Comments: 0

6G is expected to begin rolling out in 2030, but advances in 5G will inch cellular technology close enough that it will make the first 6G implementations seem more like just another upgrade. That's just the starting point, though. 6G technology gets much more interesting from there, connecting more devices at a significantly higher data rate, and enabling services that would be unattractive to ... » read more

Chip Industry Week in Review
By The SE Staff - 03 Jul, 2025 - Comments: 0

[Editor's Note: Early edition due to the U.S. July 4th holiday.] The U.S. government lifted export restrictions that barred Synopsys, Siemens EDA, and Cadence from selling EDA tools to China. In a statement, Synopsys said it received a letter from the U.S. Commerce Department immediately rescinding those restrictions. Siemens issued a similar statement. Which tools or hardware accelerated t... » read more

Chip Industry Week in Review
By The SE Staff - 27 Jun, 2025 - Comments: 0

AI featured big at this week's Design Automation Conference (DAC) in San Francisco. Dozens of companies featured AI-related tools (see product section below), as well as significant improvements to existing tools and some entirely new approaches for designing chips. Among the highlights: Siemens unveiled an AI-enhanced toolset for the EDA design flow that enables customers to integrate the... » read more

Chip Industry Week in Review
By The SE Staff - 13 Jun, 2025 - Comments: 0

The Chinese Academy of Sciences unveiled a fully automated processor chip design system, claiming the potential to accelerate semiconductor development and replace human programmers. Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, which is $30 billion higher than previously reported. AMD laun... » read more

Multi-Die Assemblies Complicate Parasitic Extraction
By Ann Mutschler - 12 Jun, 2025 - Comments: 0

The shift from planar designs to multi-die assemblies with complex interconnects is transforming what had become almost an afterthought in the design process into a first-order challenge. Parasitics include things like inductance, capacitance, and resistance, which have become more problematic at advanced nodes due to increasing logic density, thinner interconnects and insulators, and a spik... » read more

Chip Industry Week in Review
By The SE Staff - 06 Jun, 2025 - Comments: 0

Qualcomm announced plans to buy Alphawave Semi for ~$2.4 billion in a deal expected to close in Q1 2026. Qualcomm plans to leverage Alphawave Semi's connectivity products, including chiplets, to develop high-performance, low-power solutions for AI inferencing and customized CPUs in data centers. Qualcomm's traditional targets were mobile phones and edge computing. [Updated 6/9.] Global semic... » read more

Mobile Chip Challenges In The AI Era
By Liz Allan - 05 Jun, 2025 - Comments: 0

Leading smart phone vendors are struggling to keep pace with the rising compute and power demands of localized generative AI, standard phone functions, and the need to move more data back and forth between handsets and the cloud. In addition to edge functions, such as facial recognition and other on-device apps, phones must accommodate a continuous stream of new communications protocols, and... » read more

Chip Industry Week in Review
By The SE Staff - 30 May, 2025 - Comments: 1

The U.S. Commerce Department is tightening controls on EDA software sold to China by imposing additional license requirements. EDA companies are assessing the impact. Details on how broad the restrictions will be are still pending. The U.S. Federal Trade Commission (FTC) will require Synopsys and Ansys to divest key software assets — including optical, photonic, and RTL power analysis tool... » read more

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