Chip Industry Week In Review


By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Startup Funding: March 2022


Semiconductor manufacturing, test, and inspection equipment startups did well in March. Investors funded a wide variety of equipment companies, including test equipment, materials handling, and those that make parts and components. In the manufacturing space, several companies developing manufacturing execution systems received funding, as well as a startup trying to prevent counterfeit parts f... » read more

Startup Funding: January 2022


China's startups are the star of the month once again, with more companies based or co-headquartered in the country receiving funding in January 2022 than the rest of the world combined. Exact investment figures for Chinese startups are frequently not reported, but based on minimum amounts given, they raised more than the rest of the world as well. The largest round of the month went to a co... » read more

The Week In Review: Manufacturing


Samsung Electronics signed a memorandum of understanding to construct a new semiconductor fab in the company’s Godeok Industrial Complex in Pyeongtaek. The construction of the new semiconductor fabrication plant will begin during the first half of 2015, and operations are scheduled to begin sometime during the second half of 2017. United Microelectronics Corp. (UMC) will participate in a t... » read more