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Chip Industry Week In Review

By The SE Staff - 10 Jul, 2026 - Comments: 0

Micron The memory maker rolled out a slew of announcements this week, including: Raised its planned U.S. investment to more than $250B through 2035, an incremental $50B above what was announced last June, with an ultimate goal of producing 40% of its DRAM in the U.S.; Planned new investments of $3B for U.S. IC supply-chain investments, including $500M in financing for GlobalWafers’ 3... » read more

Chip Industry Week In Review

By The SE Staff - 27 Mar, 2026 - Comments: 0

Arm uncorked its first internally developed CPU chip this week, aimed squarely at the agentic AI data center market. Arm CEO Rene Haas (pictured) emphasized the CPU's power efficiency and performance/watt compared to other AI processor architectures. "We are obsessed with efficiency, and if you think about one of the biggest appeals that Arm has had over the years, it is power profile," he ... » read more

Week In Review: IoT, Security, Auto

By SE Staff - 06 Dec, 2019 - Comments: 0

Internet of Things SiFive is bringing RISC-V to IoT makers and university developers through the RISC-V-based SiFive Learn Initiative, an open-source learning package that can be used to create a low-cost RISC-V hardware compatible with AWS IoT Core. The development platform SiFive Learn Inventor has a software package and education enablement course. It includes: The programmable SiFive Lear... » read more

Trending Articles

Chip Industry Week In Review

Onsemi to buy Synaptics; IBM's 7Å chip w/40% more SRAM area; 1nm MoS2 nanotubes; AI pressure points; memory updates; $250M CHIPS Act award; trade secret theft; new advanced packaging site; MEMS capacity; humanoids; earnings.

by The SE Staff

Chip Industry Week In Review

S. Korea goes All In on AI; new Dresden power fab; Intel expansion; GM secures memory supply; AI power management funding; mature-node foundry capacity; 300mm fab equipment; McKinsey's map of strategic IC supply; security threats; AI burnout.

by The SE Staff

Executive Outlook: Agentic AI’s Impact On Chip Design

Can engineers trust AI to get everything right in semiconductor design and verification?

I/O Design Challenges Grow In AI Data Centers And HPC Clusters

Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnect protocols, requiring design tradeoffs and extra reliability measures.

Chip Industry Week In Review

Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; earnings; Rapidus teams up.

by The SE Staff

Knowledge Centers
Entities, people and technologies explored

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TSMC Tech Symposium 2026, By The Numbers

Foundry rolls out aggressive new roadmap, focusing on area, power, and latency.

by Barry Pangrle

Silicon Photonics Lights The Way To More Efficient Data Centers

Optical is the future, but getting there is harder than it looks.

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Memory Wall Gets Higher

With SRAM failing to scale in recent process nodes, the industry must assess its impact on all forms of computing. There are no easy solutions on the horizon.

by Brian Bailey

TSV Complexity Leads To Manufacturing Bottleneck

Creating through-silicon vias is a necessary but daunting challenge.

by Laura Peters

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