Is End-To-End Security Possible?


Looming financial penalties for data breaches are forcing chipmakers to confront end-to-end security, an increasingly complex and daunting problem because no single company controls all the pieces anymore. This is especially apparent in multi-die assemblies, in use today in data centers, and under consideration in automotive and other applications. Multiple chiplets can push performance well... » read more

Security Threats Converge On IoT, Industrial ICs, Physical AI


Devices in a broad range of edge AI applications are increasingly at risk of hacking or tampering, with the stakes varying greatly depending on how much the device can impact and interact with human life. Design methods and protection techniques must now be included up front in the design cycle for optimal protection of consumers and companies as the quantum threat looms. In today’s factor... » read more

Environmental Sensors Catch More Data For A Greener World


Sensors to detect temperature, pressure, and gases, such as CO2, have been around for centuries. However, the latest devices can measure a growing list of substances and process the data in real-time. Likewise, single-use sensors to measure pH levels in water are well established, but the latest water sensors can be deployed all along the pipeline from source to processing to outlet or tap, sav... » read more

Charting The Course For A Truly Multi-Modal Device Edge


The world is witnessing an AI tsunami. While the initial waves of this technological shift focused heavily on the cloud, a powerful new surge is now building at the edge. This rapid infusion of artificial intelligence is set to redefine IoT devices and applications, from sophisticated smart homes to highly efficient industrial environments. This evolution, however, has created significant fr... » read more

Small Language Models Create New Security Risks


The rollout of edge AI is creating new security risks due to a mix of small language models (SLMs), their integration into increasingly complex hardware, and the behavior and interactions of both over time. AI data centers still garner the most attention due to massive investments and an ongoing flood of deals and acquisitions, but the edge is quietly starting to take shape for several reaso... » read more

Physical AI Takes Functional Safety Cues From Automotive


Robots are becoming smarter, more capable, and more pervasive, setting the stage for a whole new round of growth that will touch nearly every part of the semiconductor and software industries for decades to come. Robots are at the core of physical AI, a broad segment of edge AI systems that interact with the world through artificial intelligence and sensors. This includes everything from hum... » read more

Harnessing Silicon Lifecycle Management For Chip Security


Silicon lifecycle management is starting to be used in ways that extend well beyond its original mission of ensuring a chip functions to spec throughout its expected lifetime. While tracking aging effects and component failures are still important, the technology also is being deployed to proactively monitor, authenticate, and respond to potential threats in real-time. In fact, not applying ... » read more

Edge AI Is Starting To Transform Industrial IoT


A slew of wireless and increasingly multi-modal sensors is being targeted at the Industrial Internet of Things (IIoT), setting the stage for significant improvements in efficiency, higher yield, and reduced downtime. Wired IIoT devices, such as smart energy meters and breakers, industrial network gateways, and environmental sensors already are well established in factory settings. They have ... » read more

Chip Industry Week in Review


Samsung reportedly is hiking memory chip prices by 30% to 60% due to high demand from AI data centers and constrained supplies. Those shortages are causing ripples elsewhere. SMIC, China's largest foundry, said its customers are holding back orders for other types of semiconductor due to concerns about memory supplies. Meanwhile, interest in photonics and power semiconductors is picking up, ... » read more

Chip Industry Week in Review


SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

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