tag: Taiyo Yuden

Chip Industry Week In Review
By The SE Staff - 05 Jan, 2024 - Comments: 0

By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Aug, 2021 - Comments: 0

Chipmakers Taiwan’s Foxconn continues to expand its efforts in the semiconductor business. Foxconn has acquired a 6-inch wafer fab and the equipment from Taiwan’s Macronix for NT$2.52 billion (US$90.76 million). With the fab, Foxconn plans to enter the wideband gap semiconductor market, namely silicon carbide (SiC). SiC devices are used in electric vehicles, a market that Foxconn is making... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

Scaling Battery Technology
By Jim Feldhan - 23 Sep, 2019 - Comments: 0

Batteries are an essential ingredient for the growth of electronics from small devices used for IoT as well as large batteries for electric cars. Historically, battery energy density improves 5%-8% per year. While this is much slower than the historical improvements from Moore’s Law, it’s still the kind of growth that can result in leaps in efficiency, opening the door for a better experien... » read more

Embedded Die Packaging Emerges
By Mark LaPedus - 09 Apr, 2018 - Comments: 1

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

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