NAND Flash Targets 1,000 Layers
New techniques go beyond improved deposition and etching, but challenges stack up, too.
One Chip Vs. Many Chiplets
Challenges and options vary widely depending on markets, workloads, and economics.
FOPLP Gains Traction in Advanced Semiconductor Packaging
Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable challenge.
HBM Options Increase As AI Demand Soars
But manufacturing reliable 3D DRAM stacks with good yield is complex and costly.
Asia Government Funding Surges
Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and talent.
Shift Left Is The Tip Of The Iceberg
A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.
Partitioning In The Chiplet Era
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
NAND Flash Targets 1,000 Layers
New techniques go beyond improved deposition and etching, but challenges stack up, too.
3.5D: The Great Compromise
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.
AI’s Role In Chip Design Widens, Drawing In New Startups
Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.
What Comes After HBM For Chiplets
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?
Memory Fundamentals For Engineers
eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.
New AI Processors Architectures Balance Speed With Efficiency
Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.
