Advanced Packaging: IPL Reflow Technology For Thermal Regulation (Sungkyunkwan Univ.)


A new technical paper titled "A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging" was published by researchers at Sungkyunkwan University. Excerpt from paper: "This study introduces a color-coded intense pulsed light (IPL) reflow process, leveraging differential light absorption for localized thermal modulation, enabling simu... » read more