tag: thermal

A Better Way To Measure Heat
By John Parry - 24 Nov, 2015 - Comments: 0

Are you an engineering manager with budget responsibility, concerned about the thermal performance of your company’s designs or manufactured products? Or, are you a senior engineer who is responsible for the thermal design or characterization of components and systems? In either situation, the results of using the transient thermal testing method would be of benefit to you. The method is non-... » read more

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect
By Norman Chang - 15 Oct, 2015 - Comments: 0

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power techniques are widely used, while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected d... » read more

New System Requirements Demand a Creatively Choreographed Ecosystem
By Jim Feldhan - 17 Sep, 2015 - Comments: 0

In the past, integrated circuits, packages and boards were all designed independently, and yet in most cases still managed to fit together with very few functional or technical problems. However, recent advances in chip performance have changed this process dramatically. New designs, processes and materials already have been seen in packaging as high-performance semiconductor chips need to c... » read more

Power/Performance Bits: July 14
By Jesse Allen - 14 Jul, 2015 - Comments: 0

Photo-doping semiconductors Scientists at Michigan State University found that by shooting an ultrafast laser pulse into a semiconducting material, its properties would change as if it had been chemically doped, in a process known as photo-doping. "The material we studied is an unconventional semiconductor made of alternating atomically thin layers of metals and insulators," said Chong-Yu... » read more

Thermal Is Still Simmering
By Ann Mutschler - 12 Mar, 2015 - Comments: 0

With the ever increasing sophistication in today’s high-performance [getkc id="81" kc_name="SoC"]s on top of sheer physics of device manufacturing, thermal is a much bigger concern than ever before. It is well understood that thermal and power are closely related, and there exists a vicious cycle between leakage power and temperature: leakage goes up, temperature goes up; temperature goes ... » read more

Tech Talk: Photonics, Take 2
By Ed Sperling - 23 Jun, 2014 - Comments: 0

Mentor Graphics’ John Ferguson explains why light is getting so much attention for inter-chip communications, where it excels, and why it has limitations. This is the second part in a two-part series. [youtube vid=4-5FbxIpIk4] To view part 1, click here. » read more

Tech Talk: Silicon Photonics
By Ed Sperling - 21 May, 2014 - Comments: 2

Mentor Graphics' John Ferguson explains why light is getting so much attention for inter-chip communications, where it excels, and why it has limitations. This is the first part in a two-part series. [youtube vid=0ydkDmrSrF4] » read more

Thermally Challenged
By Brian Bailey - 05 Dec, 2013 - Comments: 0

Chips run hot and the thermal densities increase with every reduction in fabrication geometry. “When we go down to 16nm the local power density increases by 25% and the local gate density also increases by 25% to 30%,” explains Norman Chang, vice president of product strategy at Ansys/Apache. In fact, this is becoming such a large problem that it is affecting the scaling process itsel... » read more

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