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Temperature Reduction on a High-Power Thermal Demonstrator


High-power applications in microelectronic devices and systems is a crucial and severe issue that may cause elevated thermal and thermomechanical phenomena and finally lead the fabricated system to degradation, limitation of its performance, or even failure and destruction of its features. In specific applications, such as those found in the industry and the automotive sector, the power pro... » read more

Stacked Die Changes


Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at Samsung; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. What follows are excerpts of tha... » read more