Fan-Out Wars Begin

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

OSAT Biz: Growth And Challenges

Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more