Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Apr, 2019 - Comments: 0

Internet of Things Microsoft has new services and capabilities for Azure-connected Internet of Things devices. There’s a new IoT security tool called Azure Security Center for IoT, which ties in with other tools within Azure IoT Hub. Azure Security Center for IoT uses Azure Security Center, Microsoft’s threat intelligence offering. The new IoT security tool also hooks into Azure Sentinel, ... » read more

Manufacturing Bits: Jan. 13

By Mark LaPedus - 13 Jan, 2015 - Comments: 0

Pop-up 3D printing Northwestern University and the University of Illinois at Urbana-Champaign have developed a new “pop-up” printing technique to make 3D structures down to 100nm. The technique has advantages over today’s 3D printing, which is creating a lot of buzz, if not hype, in the market. Researchers from Northwestern and Illinois devised a printing technique that mimics the act... » read more

Manufacturing Bits: Dec. 23

By Mark LaPedus - 23 Dec, 2014 - Comments: 0

Higgs boson sensors At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, CERN described the tiny hybrid pixel detectors used at the Large Hadron Collider (LHC). Using CMOS technology, hybrid pixel detectors identify and tag individual sub-atomic particles at fast speeds. CERN, the European Organization for Nuclear Research, is a particle physics laboratory... » read more

Manufacturing Bits: Oct. 7

By Mark LaPedus - 07 Oct, 2014 - Comments: 0

Europe’s TFET project A new European project has revealed more details about its plans to develop a next-generation chip technology called tunnel field-effect transistors (TFETs). EPFL is coordinating this new European research project, dubbed E2SWITCH. The project also includes IBM, Forschungszentrum Jülich, the University of Lund, ETHZ, Imec, CCS, SCIPROM and IUNET. The project has be... » read more

Manufacturing Bits: May 13

By Mark LaPedus - 13 May, 2014 - Comments: 0

Telling a FIB The National Institute of Standards and Technology (NIST) has built the first low-energy focused ion beam (FIB) microscope that uses a lithium ion source. Still in the R&D stage, the FIB microscope from NIST could be used to examine adjacent materials that are chemically different and identify the elements that make them up. The FIB microscope uses an ion source based on p... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.